Physical characteristics:

Module Name: CHSM6612M/HV-365
Maximum Power:365.0Wp

Open Circuit Voltage(Voc):47.82V

Short Circuit Curent(lsc):9.75A

Voltage at Pmax(Vmp):39.38V

Current at Pmax(lmp):9.27A

Maximum System Voltage: DC15o0V

Power Tolerance:0~+5W

Nominal Operating Cell Temp(NOCT):46℃
Cell Technology: Mono-si

Fire rating: ClassC

Module Application: Class A Module Safety Class

Solar Cell Production Line

Cleaning & Texturing: Wafers are cleaned with industrial soaps and form square-based pyramids also called texture. The texturization helps to reduce the reflection of sunlight.

Diffusion: Wafers that have been pre-droped with boron during the casting process are then given a negative(n-type) surface characteristic by diffusing them with a phosphorus source at high temperature, which in turn creats the negative/positive(n-p) junction.

Etching: Phosphorus diffuses not only into the desired wafer surface but also into the side and the opposite surface to form PN. This gives a shunt path between the cell front and rear. Removal of the path around the wafer edge/edge junction isolation is named etching.

PECVD: By PECVD equipment, the wafers are coated with anti-reflection coating(ARC). It's the blue silicion nitride film to reduce reflection and promote absorption of light.

Printing & Heating: it was adopted by printing paste with screen technology to print the electrodes of silicion solar, and form a good ohmic contact.
Testing & Sorting: It means classifying the cells according to their efficiency tested under the simulated sunlight.